Microwave and Millimeter-Wave Electronic Packaging - Rick Sturdivant - Hardback Bog - Artech House Publishers - 2013 - Engelsk - Booktok.dk
Brand: Artech House Publishers
Description
Preface; Introduction; Materials; Ceramic Packaging; Laminate Packaging; First Level Interconnects; Second Level Interconnects; Modules and Motherboards; Transitions and 3D Packaging; Heat Transfer; Electromagnetic Modeling; Conclusions
