ASUS Pro WS X299 SAGE II - Intel - LGA 2066 (Socket R4) - Intel Core X-Serie - DDR4-SDRAM - 256 GB - 2400,2666,2933,3600,4000,4133,4200,4266 MHz
Intel LGA 2066 socket: Ready for the latest Intel® Core™ X-series processorsAI Overclocking: Quickly optimizes CPU performance by profiling the CPU and cooler, achieving results that are extremely close to manual tuning by expertsDual Intel® 2.5G LAN: Offers increased data throughput and improved efficiency, making it ideal for large file transfers and backupFits up to 4-way graphics cards: Includes 7 PCIe Gen 3 x16 slots and supports NVIDIA® SLI and AMD CrossFire™Ultra-efficient VRM heatsink: Metal-fin-array design maximizes surface area for heat dissipation to enable unthrottled performanceNext-gen connectivity: Next-gen transfer speedswith dual M.2, triple U.2 and USB 3.2 Gen 2 Type-A and Type-C™Intel LGA 2066 socket: Ready for the latest Intel® Core™ X-series processorsAI Overclocking: Quickly optimizes CPU performance by profiling the CPU and cooler, achieving results that are extremely close to manual tuning by expertsDual Intel® 2.5G LAN: Offers increased data throughput and improved efficiency, making it ideal for large file transfers and backupFits up to 4-way graphics cards: Includes 7 PCIe Gen 3 x16 slots and supports NVIDIA® SLI and AMD CrossFire™Ultra-efficient VRM heatsink: Metal-fin-array design maximizes surface area for heat dissipation to enable unthrottled performanceNext-gen connectivity: Next-gen transfer speedswith dual M.2, triple U.2 and USB 3.2 Gen 2 Type-A and Type-C™Intel LGA 2066 socket: Ready for the latest Intel® Core™ X-series processorsAI Overclocking: Quickly optimizes CPU performance by profiling the CPU and cooler, achieving results that are extremely close to manual tuning by expertsDual Intel® 2.5G LAN: Offers increased data throughput and improved efficiency, making it ideal for large file transfers and backupFits up to 4-way graphics cards: Includes 7 PCIe Gen 3 x16 slots and supports NVIDIA® SLI and AMD CrossFire™Ultra-efficient VRM heatsink: Metal-fin-array design maximizes surface area for heat dissipation to enable unthrottled performanceNext-gen connectivity: Next-gen transfer speedswith dual M.2, triple U.2 and USB 3.2 Gen 2 Type-A and Type-C™
